Intel Core i3-2100 processor 3.1 GHz 3 MB Smart Cache Box
Intel Core i3-2100, Intel® Core™ i3, LGA 1155 (Socket H2), 32 nm, Intel, i3-2100, 3.1 GHz
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The Intel Flexible Display Interface is an innovative path for two independently controlled channels of integrated graphics to be displayed.
Intel Clear Video HD Technology
Intel Clear Video HD Technology delivers High Definition quality playback so that you can experience movies and games like never before.
Intel Hyper-Threading Technology
Intel Hyper-Threading Technology (Intel HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel Virtualization Technology (VT-x)
Intel Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel 64
Intel 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep Technology
Enhanced Intel SpeedStep Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel Fast Memory Access
Intel Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.
Intel Flex Memory Access
Intel Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.
Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Intel VT-x with Extended Page Tables (EPT)
Intel VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel Core i3-2100. Processor family: Intel® Core™ i3, Processor socket: LGA 1155 (Socket H2), Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 32 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics card model: Intel® HD Graphics 2000, On-board graphics card base frequency: 850 MHz, On-board graphics card dynamic frequency (max): 1100 MHz. Market segment: Desktop, Supported instruction sets: SSE4.1, SSE4.2, AVX, Export Control Classification Number (ECCN): 3A991. Package width: 81 mm, Package depth: 114 mm, Package height: 102 mm
Processore | |
Produttore processore | Intel |
Famiglia processore | Intel® Core™ i3 |
Generazione del processore | Intel® Core™ i3 di seconda generazione |
Modello del processore | i3-2100 |
Frequenza base del processore | 3,1 GHz |
Numero di core del processore | 2 |
Presa per processore | LGA 1155 (Socket H2) |
Litografia processore | 32 nm |
Scatola | Sì |
Raffreddatore incluso | Sì |
Componente per | PC |
Serie di processore | Intel Core i3-2100 Desktop Series |
Numero di threads del processore | 4 |
Bus di sistema | 5 GT/s |
Modalità di funzionamento del processore | 64-bit |
Cache processore | 3 MB |
Tipo di cache del processore | Cache intelligente |
Thermal Design Power (TDP) | 65 W |
Passo | Q0 |
Tipo di bus | DMI |
CPU multiplier (bus/core ratio) | 31 |
Banda di memoria supportata dal processore (max) | 21 GB/s |
Nome in codice del processore | Sandy Bridge |
Processore ARK ID | 53422 |
Generation | 2nd Generation |
Memoria | |
Memoria interna massima supportata dal processore | 32 GB |
Tipologie di memoria supportati dal processore | DDR3-SDRAM |
Velocità memory clock supportate dal processore | 1066,1333 MHz |
Canali di memoria | Dual-channel |
Grafica | |
Scheda grafica integrata | Sì |
Modello scheda grafica integrata | Intel® HD Graphics 2000 |
Frequenza dinamica dell'adattatore della scheda grafica integrata (max) | 1100 MHz |
Numero di visualizzazioni (scheda grafica integrata) | 2 |
ID dell'adattatore della scheda grafica installata | 0x102 |
Caratteristiche | |
Tecnologia Thermal Monitoring | Sì |
Segmento di mercato | Desktop |
Numero massimo di corsie Express PCI | 16 |
Versione degli slot PCI Express | 2.0 |
Istruzioni supportate | SSE4.1, SSE4.2, AVX |
Revisione PCI Express CEM | 2.0 |
Numero di classificazione del controllo delle esportazioni (ECCN) | 3A991 |
Sistema di tracciamento automatico della classificazione delle merci (CCATS) | NA |
Mappatura dell'immagine | |
Caratteristiche speciali del processore | |
Tecnologia Intel® Trusted Execution | No |
Ammissibilità della piattaforma Intel® vPro™ | No |
Condizioni ambientali | |
Tcase | 69,1 °C |
Dimensioni e peso | |
Dimensione della confezione del processore | 37.5 x 37.5 mm |
Altre caratteristiche | |
Tecnologia Intel® Virtualization (Intel® VT) | VT-x |
Cache memory | 3 MB |
- Processor family
- Intel® Core™ i3
- Processor cores
- 2
- Processor socket
- LGA 1155 (Socket H2)
- Processor lithography
- 32 nm
- Box
- Y
- Processor manufacturer
- Intel
- Processor model
- i3-2100
- Processor operating modes
- 64-bit
- Memory channels
- Dual-channel
- On-board graphics adapter
- Y
- On-board graphics adapter model
- Intel® HD Graphics 2000
- Cooler included
- Y
- Processor base frequency
- 3.1 GHz
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